Assignee
F&K DELVOTEC BONDTECHNIK GMBH
DE·10 granted patents·2 pending applications·177 citations·filing 1992–2018
Top patents by PatentIndex Score
12 records- 0174US5314105AWire bonding ultrasonic control system responsive to wire deformationF&K DELVOTEC BONDTECHNIK GMBH·Filed 1992·Granted May 24, 1994·51 cites·6 claims
- 0272US6206275B1Deep access, close proximity, fine pitch bonding of large wireF&K DELVOTEC BONDTECHNIK GMBH·Filed 2000·Granted Mar 27, 2001·21 cites·22 claims
- 0371US6891730B2Circuit housingF&K DELVOTEC BONDTECHNIK GMBH·Filed 2001·Granted May 10, 2005·18 cites·25 claims
- 0469US6827248B2Cutting device for bonded wiresF&K DELVOTEC BONDTECHNIK GMBH·Filed 2002·Granted Dec 7, 2004·16 cites·22 claims
- 0551US5452838ABonding head for an ultrasonic bonding machineF&K DELVOTEC BONDTECHNIK GMBH·Filed 1993·Granted Sep 26, 1995·19 cites·8 claims
- 0650US5906706AWire guide for a bonding machineF&K DELVOTEC BONDTECHNIK GMBH·Filed 1997·Granted May 25, 1999·16 cites·8 claims
- 0745US5979737AUltrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detectorF&K DELVOTEC BONDTECHNIK GMBH·Filed 1997·Granted Nov 9, 1999·12 cites·10 claims
- 0844US6786320B2Chip-transferring station for a bonding machineF&K DELVOTEC BONDTECHNIK GMBH·Filed 2003·Granted Sep 7, 2004·1 cites·10 claims
- 0943US5277354ADevice for monitoring wire supply and consumptionF&K DELVOTEC BONDTECHNIK GMBH·Filed 1992·Granted Jan 11, 1994·13 cites·3 claims
- 1042US5950903ABonding headF&K DELVOTEC BONDTECHNIK GMBH·Filed 1997·Granted Sep 14, 1999·10 cites·9 claims
- 1139US2018218996A1Method For Producing Wire Bond Connection And Arrangement For Implementing The MethodF&K DELVOTEC BONDTECHNIK GMBH·Filed 2018·Application pending·0 cites
- 1237US2011259939A1Transducer of an ultrasonic bonderF&K DELVOTEC BONDTECHNIK GMBH·Filed 2010·Application pending·0 cites
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