Assignee
FASFORD TECH CO LTD
JP·8 granted patents·8 pending applications·6 citations·filing 2015–2025
Top patents by PatentIndex Score
16 records- 0184US9530751B2Die bonder and bonding methodFASFORD TECH CO LTD·Filed 2015·Granted Dec 27, 2016·6 cites·18 claims
- 0270US2025253169A1Die Bonding Apparatus and Manufacturing Method for Semiconductor ApparatusFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 0367US12374576B2Semiconductor manufacturing apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·18 claims
- 0462US12327739B2Die bonding apparatus and manufacturing method for semiconductor apparatusFASFORD TECH CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·7 claims
- 0561US2025096188A1Die Bonding Apparatus, Mounting Method, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2024·Application pending·0 cites
- 0659US11569118B2Semiconductor manufacturing apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·4 claims
- 0755US2023290666A1Semiconductor manufacturing apparatus, carrier jig, and manufacturing method of semiconductor deviceFASFORD TECH CO LTD·Filed 2023·Application pending·0 cites
- 0851US2023215770A1Semiconductor manufacturing apparatus, inspection apparatus, and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Application pending·0 cites
- 0951US2023090693A1Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Application pending·0 cites
- 1050US2024312825A1Semiconductor Manufacturing Device, Push-up Unit, and Method of Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2024·Application pending·0 cites
- 1149US2025285892A1Semiconductor Manufacturing Apparatus, Pushup Method, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 1248US12068275B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·19 claims
- 1348US2025279304A1Semiconductor Manufacturing Apparatus, Pushup Unit, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 1443US11692947B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1540US12053806B2Die bonding apparatus, cleaning head and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·3 claims
- 1639US12588457B2Die bonding apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·4 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →