Assignee
FEGER CLAUDIUS
US·6 granted patents·1 pending application·34 citations·filing 2006–2012
Top patents by PatentIndex Score
7 records- 0192US8820612B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2012·Granted Sep 2, 2014·13 cites·9 claims
- 0289US8963340B2No flow underfill or wafer level underfill and solder columnsFEGER CLAUDIUS·Filed 2011·Granted Feb 24, 2015·8 cites·16 claims
- 0377US8408448B1Forming constant diameter spherical metal ballsFEGER CLAUDIUS·Filed 2012·Granted Apr 2, 2013·3 cites·10 claims
- 0473US8496159B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2011·Granted Jul 30, 2013·3 cites·11 claims
- 0573US8178153B2Heat transfer control structures using thermal phonon spectral overlapFEGER CLAUDIUS·Filed 2006·Granted May 15, 2012·7 cites·6 claims
- 0645US8636931B2Vacuum extrusion method of manufacturing a thermal pasteFEGER CLAUDIUS·Filed 2007·Granted Jan 28, 2014·0 cites·23 claims
- 0745US2009080833A1Apparatus and methods for remakeable connections to optical waveguidesFEGER CLAUDIUS·Filed 2008·Application pending·0 cites
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