Assignee
FLIP CHIP TECHNOLOGIES L L C
US·5 granted patents·638 citations·filing 1997–2001
Top patents by PatentIndex Score
5 records- 0193US6578755B1Polymer collar for solder bumpsFLIP CHIP TECHNOLOGIES L L C·Filed 2000·Granted Jun 17, 2003·88 cites·37 claims
- 0293US6287893B1Method for forming chip scale packageFLIP CHIP TECHNOLOGIES L L C·Filed 1998·Granted Sep 11, 2001·241 cites·2 claims
- 0391US6441487B2Chip scale package using large ductile solder ballsFLIP CHIP TECHNOLOGIES L L C·Filed 1997·Granted Aug 27, 2002·182 cites·19 claims
- 0489US6750135B2Method for forming chip scale packageFLIP CHIP TECHNOLOGIES L L C·Filed 2001·Granted Jun 15, 2004·64 cites·13 claims
- 0585US6445069B1Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method thereforFLIP CHIP TECHNOLOGIES L L C·Filed 2001·Granted Sep 3, 2002·63 cites·23 claims
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