Assignee
FLIPCHIP INT LLC
US·9 granted patents·3 pending applications·221 citations·filing 2000–2013
Top patents by PatentIndex Score
12 records- 0196US7011988B2Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussingFLIPCHIP INT LLC·Filed 2005·Granted Mar 14, 2006·59 cites·18 claims
- 0293US6919508B2Build-up structures with multi-angle vias for chip to chip interconnects and optical bussingFLIPCHIP INT LLC·Filed 2003·Granted Jul 19, 2005·85 cites·42 claims
- 0390US7973418B2Solder bump interconnect for improved mechanical and thermo-mechanical performanceFLIPCHIP INT LLC·Filed 2008·Granted Jul 5, 2011·27 cites·20 claims
- 0481US8686556B2Wafer level applied thermal heat sinkFLIPCHIP INT LLC·Filed 2012·Granted Apr 1, 2014·6 cites·16 claims
- 0580US9627254B2Method for building vertical pillar interconnectFLIPCHIP INT LLC·Filed 2013·Granted Apr 18, 2017·7 cites·31 claims
- 0678US7057292B1Solder bar for high power flip chipsFLIPCHIP INT LLC·Filed 2000·Granted Jun 6, 2006·30 cites·9 claims
- 0760US9070747B2Electroplating using dielectric bridgesFLIPCHIP INT LLC·Filed 2013·Granted Jun 30, 2015·1 cites·20 claims
- 0857US7118833B2Forming partial-depth features in polymer filmFLIPCHIP INT LLC·Filed 2003·Granted Oct 10, 2006·5 cites·26 claims
- 0956US8980743B2Method for applying a final metal layer for wafer level packaging and associated deviceFLIPCHIP INT LLC·Filed 2013·Granted Mar 17, 2015·1 cites·14 claims
- 1046US2009057909A1Under bump metallization structure having a seed layer for electroless nickel depositionFLIPCHIP INT LLC·Filed 2008·Application pending·0 cites
- 1140US2013093067A1Wafer level applied rf shieldsFLIPCHIP INT LLC·Filed 2012·Application pending·0 cites
- 1234US2011003470A1Methods and structures for a vertical pillar interconnectFLIPCHIP INT LLC·Filed 2010·Application pending·0 cites
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