Assignee

FONG JOHN WAI

US·1 granted patent·17 citations·filing 2006–2006

Technology mixB22C1 B29C1 B33Y1 C09D1 G03F1 G09B1

Top patents by PatentIndex Score

1 record

0162US8334025B2Antimony-free photocurable resin composition and three dimensional articleFONG JOHN WAI·Filed 2006·Granted Dec 18, 2012·17 cites·30 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →