Assignee
FORMOSA MICROSEMI CO LTD
TW·1 granted patent·2 pending applications·3 citations·filing 2004–2017
Top patents by PatentIndex Score
3 records- 0159US9064856B1Flip-chip LED component built therein with a zener chipFORMOSA MICROSEMI CO LTD·Filed 2014·Granted Jun 23, 2015·3 cites·4 claims
- 0229US2005259400A1Heat sinking structure of power semiconductorFORMOSA MICROSEMI CO LTD·Filed 2004·Application pending·0 cites
- 0318US2018166367A1Flip-chip packaging diode with a multichip structureFORMOSA MICROSEMI CO LTD·Filed 2017·Application pending·0 cites
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