Assignee
FU XINYU
US·4 granted patents·14 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0191US8580354B2Plasma treatment of substrates prior to depositionFU XINYU·Filed 2011·Granted Nov 12, 2013·11 cites·5 claims
- 0270US8586479B2Methods for forming a contact metal layer in semiconductor devicesFU XINYU·Filed 2012·Granted Nov 19, 2013·2 cites·21 claims
- 0360US8852674B2Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layersFU XINYU·Filed 2010·Granted Oct 7, 2014·1 cites·18 claims
- 0453US8168543B2Methods of forming a layer for barrier applications in an interconnect structureFU XINYU·Filed 2009·Granted May 1, 2012·0 cites·10 claims
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