Assignee
FUJI MACHINERY MFG & ELECTRONI
JP·2 granted patents·343 citations·filing 1997–1997
Top patents by PatentIndex Score
2 records- 0195US6011694ABall grid array semiconductor package with solder ball openings in an insulative baseFUJI MACHINERY MFG & ELECTRONI·Filed 1997·Granted Jan 4, 2000·240 cites·19 claims
- 0287US6040984APrinted circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levelsFUJI MACHINERY MFG & ELECTRONI·Filed 1997·Granted Mar 21, 2000·103 cites·21 claims
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