Assignee
FUJIMARU KOICHI
JP·1 granted patent·1 pending application·5 citations·filing 2006–2010
Top patents by PatentIndex Score
2 records- 0163US8653202B2Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor deviceFUJIMARU KOICHI·Filed 2006·Granted Feb 18, 2014·5 cites·5 claims
- 0227US2012129988A1Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing theseFUJIMARU KOICHI·Filed 2010·Application pending·0 cites
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