Assignee
FUJIMOTO DAISUKE
JP·1 granted patent·4 pending applications·2 citations·filing 2007–2012
Top patents by PatentIndex Score
5 records- 0170US8404769B2Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2008·Granted Mar 26, 2013·2 cites·29 claims
- 0248US2009323300A1Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring BoardFUJIMOTO DAISUKE·Filed 2007·Application pending·0 cites
- 0347US2013040153A1Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 0441US2014151091A1Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for sameFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 0537US2012305291A1Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereofFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
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