Assignee
FUK CO LTD
JP·2 granted patents·1 pending application·3 citations·filing 2014–2017
Top patents by PatentIndex Score
3 records- 0177US9987838B2Method and device for separating workpiece consisting of carrier substrate and resin layerFUK CO LTD·Filed 2017·Granted Jun 5, 2018·3 cites·7 claims
- 0244US8919406B2Bonding apparatusFUK CO LTD·Filed 2014·Granted Dec 30, 2014·0 cites·10 claims
- 0337US2016279915A1Bonding ApparatusFUK CO LTD·Filed 2015·Application pending·0 cites
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