Assignee
FUKAMIZU SHINGO
JP·1 granted patent·2 pending applications·2 citations·filing 2006–2007
Top patents by PatentIndex Score
3 records- 0155US8138615B2Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereofFUKAMIZU SHINGO·Filed 2007·Granted Mar 20, 2012·2 cites·11 claims
- 0241US2006238160A1Drive apparatusFUKAMIZU SHINGO·Filed 2006·Application pending·0 cites
- 0338US2008128826A1Semiconductor integrated circuit and fabrication method for the sameFUKAMIZU SHINGO·Filed 2007·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →