Assignee
FUKUDA MASATOSHI
JP·3 granted patents·4 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0170US8710653B2Chip on chip semiconductor device including an underfill layer having a resin containing an amine-based curing agentFUKUDA MASATOSHI·Filed 2012·Granted Apr 29, 2014·3 cites·16 claims
- 0259US8445321B2Semiconductor device and method of manufacturing the sameFUKUDA MASATOSHI·Filed 2010·Granted May 21, 2013·1 cites·19 claims
- 0339US9000535B2Semiconductor device and semiconductor device manufacturing methodFUKUDA MASATOSHI·Filed 2012·Granted Apr 7, 2015·0 cites·8 claims
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