Assignee
FUKUI PREC COMPONENT (SHENZHEN) CO LTD
CN·7 granted patents·7 pending applications·20 citations·filing 2014–2016
Top patents by PatentIndex Score
14 records- 0194US9485859B1Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Nov 1, 2016·17 cites·20 claims
- 0269US9807868B1Method for making conductive polymer, and composite film and circuit board having the conductive polymerFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Granted Oct 31, 2017·1 cites·7 claims
- 0365US9706640B2Method for manufacturing printed circuit boardFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Jul 11, 2017·1 cites·9 claims
- 0464US9615445B2Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Apr 4, 2017·1 cites·20 claims
- 0554US9820388B2Printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2014·Granted Nov 14, 2017·0 cites·18 claims
- 0652US2017354030A1High frequency signal transmission structure and method for sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Application pending·0 cites
- 0751US9788437B2Method for manufacturing printed circuit board with etching process to partially remove conductive layerFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Oct 10, 2017·0 cites·10 claims
- 0840US9693448B2Flexible circuit board and method for making the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·4 claims
- 0936US2017188451A1Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Application pending·0 cites
- 1036US2017275508A1Resin composition and adhesive film and circuit board made of the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Application pending·0 cites
- 1135US2017110244A1Circuit board for radio transceiving and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
- 1233US2016320142A1Thin heat dissipation foil and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
- 1331US2017110427A1Chip package and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
- 1429US2017079136A1Circuit board and method for making the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →