Assignee
GAMBOA CARLO
US·3 granted patents·47 citations·filing 2007–2008
Top patents by PatentIndex Score
3 records- 0186US8436460B1Multiple die paddle leadframe and semiconductor device packageGAMBOA CARLO·Filed 2007·Granted May 7, 2013·27 cites·15 claims
- 0282US8283772B1Flip-flop semiconductor device packaging using bent leadfingersGAMBOA CARLO·Filed 2007·Granted Oct 9, 2012·16 cites·10 claims
- 0358US8106489B1Integrated circuit package and packaging methodGAMBOA CARLO·Filed 2008·Granted Jan 31, 2012·4 cites·14 claims
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