Assignee
GATTERBAUER JOHANN
DE·3 granted patents·11 citations·filing 2012–2012
Top patents by PatentIndex Score
3 records- 0185US8765531B2Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangementGATTERBAUER JOHANN·Filed 2012·Granted Jul 1, 2014·11 cites·23 claims
- 0249US8822327B2Contact pads with sidewall spacers and method of making contact pads with sidewall spacersGATTERBAUER JOHANN·Filed 2012·Granted Sep 2, 2014·0 cites·10 claims
- 0344US8736062B2Pad sidewall spacers and method of making pad sidewall spacersGATTERBAUER JOHANN·Filed 2012·Granted May 27, 2014·0 cites·23 claims
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