Assignee
GAYNES MICHAEL A
US·7 granted patents·22 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0186US8651359B2Flip chip bonder head for forming a uniform filletGAYNES MICHAEL A·Filed 2010·Granted Feb 18, 2014·9 cites·12 claims
- 0283US8269340B2Curvilinear heat spreader/lid with improved heat dissipationGAYNES MICHAEL A·Filed 2007·Granted Sep 18, 2012·10 cites·13 claims
- 0363US8129230B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2009·Granted Mar 6, 2012·2 cites·13 claims
- 0462US8877566B2Curvilinear heat spreader/lid with improved heat dissipationGAYNES MICHAEL A·Filed 2012·Granted Nov 4, 2014·1 cites·12 claims
- 0554US9231139B2Structure and design of concentrator solar cell assembly receiver substrateGAYNES MICHAEL A·Filed 2011·Granted Jan 5, 2016·0 cites·22 claims
- 0650US8492910B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2012·Granted Jul 23, 2013·0 cites·4 claims
- 0745US8785217B2Tunable radiation sourceGAYNES MICHAEL A·Filed 2011·Granted Jul 22, 2014·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when GAYNES MICHAEL A files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →