Assignee
GEORGE GREGORY
US·9 granted patents·1 pending application·89 citations·filing 2009–2015
Top patents by PatentIndex Score
10 records- 0193US8551291B2Debonding equipment and methods for debonding temporary bonded wafersGEORGE GREGORY·Filed 2011·Granted Oct 8, 2013·16 cites·24 claims
- 0292US8267143B2Apparatus for mechanically debonding temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Sep 18, 2012·23 cites·11 claims
- 0390US8147630B2Method and apparatus for wafer bonding with enhanced wafer matingGEORGE GREGORY·Filed 2009·Granted Apr 3, 2012·19 cites·13 claims
- 0488US8139219B2Apparatus and method for semiconductor wafer alignmentGEORGE GREGORY·Filed 2009·Granted Mar 20, 2012·15 cites·36 claims
- 0585US8764026B2Device for centering wafersGEORGE GREGORY·Filed 2010·Granted Jul 1, 2014·8 cites·8 claims
- 0676US8919412B2Apparatus for thermal-slide debonding of temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Dec 30, 2014·3 cites·15 claims
- 0773US8425715B2Apparatus for high throughput wafer bondingGEORGE GREGORY·Filed 2011·Granted Apr 23, 2013·3 cites·17 claims
- 0863US9064686B2Method and apparatus for temporary bonding of ultra thin wafersGEORGE GREGORY·Filed 2013·Granted Jun 23, 2015·1 cites·15 claims
- 0962US8574398B2Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafersGEORGE GREGORY·Filed 2011·Granted Nov 5, 2013·1 cites·16 claims
- 1043US2015251396A1Method and apparatus for temporary bonding of ultra thin wafersGEORGE GREGORY·Filed 2015·Application pending·0 cites
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