Assignee
GERBER MARK A
US·3 granted patents·4 pending applications·27 citations·filing 2005–2011
Top patents by PatentIndex Score
7 records- 0191US8133761B2Packaged system of semiconductor chips having a semiconductor interposerGERBER MARK A·Filed 2009·Granted Mar 13, 2012·19 cites·2 claims
- 0284US8304285B2Array-molded package-on-package having redistribution linesGERBER MARK A·Filed 2011·Granted Nov 6, 2012·7 cites·21 claims
- 0359US8430969B2Method for exposing and cleaning insulating coats from metal contact surfacesGERBER MARK A·Filed 2010·Granted Apr 30, 2013·1 cites·9 claims
- 0441US2007170571A1Low profile semiconductor system having a partial-cavity substrateGERBER MARK A·Filed 2006·Application pending·0 cites
- 0541US2007216008A1Low profile semiconductor package-on-packageGERBER MARK A·Filed 2006·Application pending·0 cites
- 0640US2007210426A1Gold-bumped interposer for vertically integrated semiconductor systemGERBER MARK A·Filed 2006·Application pending·0 cites
- 0732US2006170081A1Method and apparatus for packaging an electronic chipGERBER MARK A·Filed 2005·Application pending·0 cites
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