Assignee
GOH ENG HUAT
MY·1 granted patent·2 pending applications·7 citations·filing 2012–2018
Top patents by PatentIndex Score
3 records- 0180US9257368B2Microelectric package utilizing multiple bumpless build-up structures and through-silicon viasGOH ENG HUAT·Filed 2012·Granted Feb 9, 2016·7 cites·30 claims
- 0235US2013313727A1Multi-stacked bbul packageGOH ENG HUAT·Filed 2012·Application pending·0 cites
- 0335US2019035761A1Wirebond interconnect structures for stacked die packagesGOH ENG HUAT·Filed 2018·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →