Assignee
GOLDMANN LEWIS S
US·2 granted patents·6 citations·filing 2008–2012
Top patents by PatentIndex Score
2 records- 0170US8132775B2Solder mold plates used in packaging process and method of manufacturing solder mold platesGOLDMANN LEWIS S·Filed 2008·Granted Mar 13, 2012·4 cites·14 claims
- 0268US8337735B2Solder mold plates used in packaging process and method of manufacturing solder mold platesGOLDMANN LEWIS S·Filed 2012·Granted Dec 25, 2012·2 cites·10 claims
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