Assignee
GOLLER BERND
DE·1 granted patent·1 pending application·2 citations·filing 2006–2010
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0160US8466009B2Method of fabricating a semiconductor package with mold lock openingGOLLER BERND·Filed 2010·Granted Jun 18, 2013·2 cites·14 claims
- 0235US2006157849A1Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereofGOLLER BERND·Filed 2006·Application pending·0 cites
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