Assignee
GONG YUPING
CN·7 granted patents·1 pending application·35 citations·filing 2010–2013
Top patents by PatentIndex Score
8 records- 0186US8642397B1Semiconductor wafer level package (WLP) and method of manufacture thereofGONG YUPING·Filed 2012·Granted Feb 4, 2014·9 cites·20 claims
- 0285US8841167B1Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFETGONG YUPING·Filed 2013·Granted Sep 23, 2014·8 cites·8 claims
- 0385US8519520B2Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing methodGONG YUPING·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 0482US8163601B2Chip-exposed semiconductor device and its packaging methodGONG YUPING·Filed 2010·Granted Apr 24, 2012·6 cites·11 claims
- 0576US8236613B2Wafer level chip scale package method using clip arrayGONG YUPING·Filed 2010·Granted Aug 7, 2012·4 cites·13 claims
- 0651US9006901B2Thin power device and preparation method thereofGONG YUPING·Filed 2013·Granted Apr 14, 2015·0 cites·6 claims
- 0747US2012267787A1Wafer Level Chip Scale Package Method Using Clip ArrayGONG YUPING·Filed 2012·Application pending·0 cites
- 0842US8450152B2Double-side exposed semiconductor device and its manufacturing methodGONG YUPING·Filed 2011·Granted May 28, 2013·0 cites·15 claims
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