Assignee
GONZALEZ JAVIER SOTO
US·3 granted patents·1 pending application·109 citations·filing 2008–2014
Top patents by PatentIndex Score
4 records- 0197US9559088B2Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the sameGONZALEZ JAVIER SOTO·Filed 2014·Granted Jan 31, 2017·52 cites·6 claims
- 0296US8736065B2Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the sameGONZALEZ JAVIER SOTO·Filed 2010·Granted May 27, 2014·38 cites·15 claims
- 0394US8421245B2Substrate with embedded stacked through-silicon via dieGONZALEZ JAVIER SOTO·Filed 2010·Granted Apr 16, 2013·19 cites·15 claims
- 0448US2009321932A1Coreless substrate package with symmetric external dielectric layersGONZALEZ JAVIER SOTO·Filed 2008·Application pending·0 cites
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