Assignee
GOTOH SEISAKUSHO KK
US·4 granted patents·100 citations·filing 1996–1999
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0174US5798570APlastic molded semiconductor package with thermal dissipation meansGOTOH SEISAKUSHO KK·Filed 1996·Granted Aug 25, 1998·43 cites·9 claims
- 0271US5936303APlastic molded semiconductor packageGOTOH SEISAKUSHO KK·Filed 1997·Granted Aug 10, 1999·43 cites·5 claims
- 0340US6020649APlastic molded semiconductor package and a method for producing the sameGOTOH SEISAKUSHO KK·Filed 1997·Granted Feb 1, 2000·8 cites·5 claims
- 0436US6274408B1Method for producing a plastic molded semiconductor packageGOTOH SEISAKUSHO KK·Filed 1999·Granted Aug 14, 2001·6 cites·4 claims
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