Assignee
GRILLBERGER MICHAEL
DE·3 granted patents·3 pending applications·4 citations·filing 2009–2011
Top patents by PatentIndex Score
6 records- 0166US8482123B2Stress reduction in chip packaging by using a low-temperature chip-package connection regimeGRILLBERGER MICHAEL·Filed 2011·Granted Jul 9, 2013·2 cites·23 claims
- 0259US8920027B2Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systemsGRILLBERGER MICHAEL·Filed 2011·Granted Dec 30, 2014·1 cites·15 claims
- 0355US8501545B2Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regimeGRILLBERGER MICHAEL·Filed 2010·Granted Aug 6, 2013·1 cites·21 claims
- 0447US2010109005A1Semiconductor device comprising a distributed interconnected sensor structure for die internal monitoring purposesGRILLBERGER MICHAEL·Filed 2009·Application pending·0 cites
- 0546US2010252828A1Semiconductor device comprising a chip internal electrical test structure allowing electrical measurements during the fabrication processGRILLBERGER MICHAEL·Filed 2009·Application pending·0 cites
- 0645US2009294921A1Semiconductor device comprising metal lines with a selectively formed dielectric cap layerGRILLBERGER MICHAEL·Filed 2009·Application pending·0 cites
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