Assignee
GRUBER PETER A
US·10 granted patents·2 pending applications·107 citations·filing 2007–2012
Top patents by PatentIndex Score
12 records- 0197US8828860B2Double solder bumps on substrates for low temperature flip chip bondingGRUBER PETER A·Filed 2012·Granted Sep 9, 2014·30 cites·23 claims
- 0293US8162203B1Spherical solder reflow methodGRUBER PETER A·Filed 2011·Granted Apr 24, 2012·14 cites·16 claims
- 0393US8117982B2Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant moldGRUBER PETER A·Filed 2009·Granted Feb 21, 2012·25 cites·3 claims
- 0489US8492262B2Direct IMS (injection molded solder) without a mask for forming solder bumps on substratesGRUBER PETER A·Filed 2010·Granted Jul 23, 2013·11 cites·9 claims
- 0588US9082754B2Metal cored solder decal structure and processGRUBER PETER A·Filed 2012·Granted Jul 14, 2015·5 cites·13 claims
- 0683US8138020B2Wafer level integrated interconnect decal and manufacturing method thereofGRUBER PETER A·Filed 2010·Granted Mar 20, 2012·7 cites·25 claims
- 0781US8272120B2Apparatus for applying solder to semiconductor chips using decals with aperatures present thereinGRUBER PETER A·Filed 2011·Granted Sep 25, 2012·5 cites·9 claims
- 0878US8104668B2Method and apparatus providing fine alignment of a structure relative to a supportGRUBER PETER A·Filed 2010·Granted Jan 31, 2012·3 cites·11 claims
- 0977US8157158B2Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2007·Granted Apr 17, 2012·5 cites·12 claims
- 1073US8528805B2Method and apparatus providing fine alignment of a structure relative to a supportGRUBER PETER A·Filed 2011·Granted Sep 10, 2013·2 cites·10 claims
- 1156US2012205425A1Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2012·Application pending·0 cites
- 1256US2012201596A1Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2012·Application pending·0 cites
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