Assignee
GRUENHAGEN MICHAEL D
US·3 granted patents·1 pending application·27 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0182US8072044B2Semiconductor die containing lateral edge shapes and texturesGRUENHAGEN MICHAEL D·Filed 2009·Granted Dec 6, 2011·14 cites·23 claims
- 0279US8058732B2Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2008·Granted Nov 15, 2011·10 cites·33 claims
- 0372US8598035B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 0443US2011006409A1Nickel-titanum contact layers in semiconductor devicesGRUENHAGEN MICHAEL D·Filed 2009·Application pending·0 cites
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