Assignee
GUZEK JOHN
US·2 granted patents·17 citations·filing 2008–2009
Top patents by PatentIndex Score
2 records- 0191US8742561B2Recessed and embedded die coreless packageGUZEK JOHN·Filed 2009·Granted Jun 3, 2014·15 cites·12 claims
- 0262US9113547B2Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)GUZEK JOHN·Filed 2008·Granted Aug 18, 2015·2 cites·7 claims
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