Assignee
HABA BELGACEM
US·60 granted patents·7 pending applications·1,674 citations·filing 2004–2012
Top patents by PatentIndex Score
67 records- 0199US8728865B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted May 20, 2014·88 cites·16 claims
- 0299US8482111B2Stackable molded microelectronic packagesHABA BELGACEM·Filed 2010·Granted Jul 9, 2013·121 cites·15 claims
- 0399US8093697B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2010·Granted Jan 10, 2012·117 cites·16 claims
- 0499US8076788B2Off-chip vias in stacked chipsHABA BELGACEM·Filed 2010·Granted Dec 13, 2011·74 cites·17 claims
- 0599US8058101B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2005·Granted Nov 15, 2011·87 cites·16 claims
- 0698US8916781B2Cavities containing multi-wiring structures and devicesHABA BELGACEM·Filed 2011·Granted Dec 23, 2014·43 cites·36 claims
- 0798US8841765B2Multi-chip module with stacked face-down connected diesHABA BELGACEM·Filed 2011·Granted Sep 23, 2014·64 cites·26 claims
- 0898US8823165B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Sep 2, 2014·34 cites·54 claims
- 0998US8680684B2Stackable microelectronic package structuresHABA BELGACEM·Filed 2012·Granted Mar 25, 2014·89 cites·36 claims
- 1098US8580607B2Microelectronic packages with nanoparticle joiningHABA BELGACEM·Filed 2010·Granted Nov 12, 2013·49 cites·19 claims
- 1198US8525314B2Stacked packaging improvementsHABA BELGACEM·Filed 2005·Granted Sep 3, 2013·98 cites·6 claims
- 1298US8513817B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Aug 20, 2013·65 cites·50 claims
- 1398US8338963B2Multiple die face-down stacking for two or more dieHABA BELGACEM·Filed 2011·Granted Dec 25, 2012·51 cites·30 claims
- 1498US8329581B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted Dec 11, 2012·45 cites·17 claims
- 1598US8330272B2Microelectronic packages with dual or multiple-etched flip-chip connectorsHABA BELGACEM·Filed 2010·Granted Dec 11, 2012·66 cites·47 claims
- 1697US8697492B2No flow underfillHABA BELGACEM·Filed 2010·Granted Apr 15, 2014·36 cites·19 claims
- 1797US8637991B2Microelectronic package with terminals on dielectric massHABA BELGACEM·Filed 2011·Granted Jan 28, 2014·37 cites·28 claims
- 1897US8304881B1Flip-chip, face-up and face-down wirebond combination packageHABA BELGACEM·Filed 2011·Granted Nov 6, 2012·28 cites·22 claims
- 1996US8405196B2Chips having rear contacts connected by through vias to front contactsHABA BELGACEM·Filed 2008·Granted Mar 26, 2013·33 cites·12 claims
- 2096US8310036B2Chips having rear contacts connected by through vias to front contactsHABA BELGACEM·Filed 2010·Granted Nov 13, 2012·27 cites·25 claims
- 2196US8193615B2Semiconductor packaging process using through silicon viasHABA BELGACEM·Filed 2008·Granted Jun 5, 2012·42 cites·32 claims
- 2296US8071424B2Substrate for a microelectronic package and method of fabricating thereofHABA BELGACEM·Filed 2010·Granted Dec 6, 2011·49 cites·38 claims
- 2395US8680662B2Wafer level edge stackingHABA BELGACEM·Filed 2009·Granted Mar 25, 2014·38 cites·27 claims
- 2494US8461672B2Reconstituted wafer stack packaging with after-applied pad extensionsHABA BELGACEM·Filed 2008·Granted Jun 11, 2013·27 cites·38 claims
- 2594US8431435B2Edge connect wafer level stackingHABA BELGACEM·Filed 2010·Granted Apr 30, 2013·12 cites·7 claims
- 2694US8207604B2Microelectronic package comprising offset conductive posts on compliant layerHABA BELGACEM·Filed 2004·Granted Jun 26, 2012·93 cites·20 claims
- 2793US8928153B2Flip-chip, face-up and face-down centerbond memory wirebond assembliesHABA BELGACEM·Filed 2011·Granted Jan 6, 2015·13 cites·23 claims
- 2893US8780576B2Low CTE interposerHABA BELGACEM·Filed 2011·Granted Jul 15, 2014·12 cites·29 claims
- 2991US8637968B2Stacked microelectronic assembly having interposer connecting active chipsHABA BELGACEM·Filed 2010·Granted Jan 28, 2014·14 cites·33 claims
- 3089US8641913B2Fine pitch microcontacts and method for forming thereofHABA BELGACEM·Filed 2007·Granted Feb 4, 2014·17 cites·25 claims
- 3189US8513789B2Edge connect wafer level stacking with leads extending along edgesHABA BELGACEM·Filed 2007·Granted Aug 20, 2013·10 cites·10 claims
- 3287US8709933B2Interposer having molded low CTE dielectricHABA BELGACEM·Filed 2011·Granted Apr 29, 2014·8 cites·26 claims
- 3387US8461673B2Edge connect wafer level stackingHABA BELGACEM·Filed 2012·Granted Jun 11, 2013·6 cites·19 claims
- 3486US8787032B2Enhanced stacked microelectronic assemblies with central contactsHABA BELGACEM·Filed 2011·Granted Jul 22, 2014·7 cites·12 claims
- 3585US9159708B2Stackable molded microelectronic packages with area array unit connectorsHABA BELGACEM·Filed 2010·Granted Oct 13, 2015·7 cites·33 claims
- 3685US8067267B2Microelectronic assemblies having very fine pitch stackingHABA BELGACEM·Filed 2005·Granted Nov 29, 2011·14 cites·43 claims
- 3784US8575766B2Microelectronic assembly with impedance controlled wirebond and conductive reference elementHABA BELGACEM·Filed 2011·Granted Nov 5, 2013·6 cites·7 claims
- 3884US8222725B2Metal can impedance control structureHABA BELGACEM·Filed 2010·Granted Jul 17, 2012·7 cites·64 claims
- 3982US8786083B2Impedance controlled packages with metal sheet or 2-layer RDLHABA BELGACEM·Filed 2010·Granted Jul 22, 2014·5 cites·29 claims
- 4082US8623706B2Microelectronic package with terminals on dielectric massHABA BELGACEM·Filed 2011·Granted Jan 7, 2014·4 cites·12 claims
- 4182US8476774B2Off-chip VIAS in stacked chipsHABA BELGACEM·Filed 2011·Granted Jul 2, 2013·4 cites·5 claims
- 4282US8426957B2Edge connect wafer level stackingHABA BELGACEM·Filed 2011·Granted Apr 23, 2013·4 cites·13 claims
- 4381US8253259B2Microelectronic assembly with impedance controlled wirebond and reference wirebondHABA BELGACEM·Filed 2010·Granted Aug 28, 2012·5 cites·23 claims
- 4480US8569884B2Multiple die in a face down packageHABA BELGACEM·Filed 2011·Granted Oct 29, 2013·4 cites·37 claims
- 4579US8735287B2Semiconductor packaging process using through silicon viasHABA BELGACEM·Filed 2012·Granted May 27, 2014·4 cites·16 claims
- 4678US8410618B2Microelectronic assembly with joined bond elements having lowered inductanceHABA BELGACEM·Filed 2011·Granted Apr 2, 2013·3 cites·22 claims
- 4777US8531020B2Stacked packaging improvementsHABA BELGACEM·Filed 2010·Granted Sep 10, 2013·2 cites·7 claims
- 4875US8772908B2Conductive pads defined by embedded tracesHABA BELGACEM·Filed 2012·Granted Jul 8, 2014·3 cites·26 claims
- 4964US8553420B2Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristicsHABA BELGACEM·Filed 2010·Granted Oct 8, 2013·1 cites·22 claims
- 5064US8466564B2Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distributionHABA BELGACEM·Filed 2011·Granted Jun 18, 2013·1 cites·22 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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