Assignee
HAESUNG DS CO LTD
KR·37 granted patents·21 pending applications·89 citations·filing 2012–2025
Top patents by PatentIndex Score
58 records- 0198US10739205B2Temperature sensor patch and adhesive type thermometer including the sameHAESUNG DS CO LTD·Filed 2017·Granted Aug 11, 2020·18 cites·12 claims
- 0285USD842136SElement for adhesive thermometerHAESUNG DS CO LTD·Filed 2017·Granted Mar 5, 2019·24 cites·1 claims
- 0381US9671352B2Reel-to-reel inspection apparatus and inspection method using the sameHAESUNG DS CO LTD·Filed 2013·Granted Jun 6, 2017·17 cites·16 claims
- 0479US11209323B2Sensor package with reduced height cavity walls and sensor package module including the sameHAESUNG DS CO LTD·Filed 2018·Granted Dec 28, 2021·2 cites·16 claims
- 0577USD833305SAdhesive thermometerHAESUNG DS CO LTD·Filed 2017·Granted Nov 13, 2018·16 cites·1 claims
- 0676US10942070B2Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and method of manufacturing the temperature sensorHAESUNG DS CO LTD·Filed 2018·Granted Mar 9, 2021·1 cites·13 claims
- 0776US10749066B2Proximity sensor having substrate including light sensing area and temperature sensing areaHAESUNG DS CO LTD·Filed 2018·Granted Aug 18, 2020·1 cites·7 claims
- 0875US9532466B2Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the methodHAESUNG DS CO LTD·Filed 2012·Granted Dec 27, 2016·3 cites·12 claims
- 0972US9460986B2Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2015·Granted Oct 4, 2016·3 cites·9 claims
- 1070US12457694B2Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing methodHAESUNG DS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·10 claims
- 1170US9171789B2Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frameHAESUNG DS CO LTD·Filed 2013·Granted Oct 27, 2015·3 cites·16 claims
- 1268US10910299B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the methodHAESUNG DS CO LTD·Filed 2018·Granted Feb 2, 2021·1 cites·18 claims
- 1366US12104964B2Sensor package and sensor package module including the sameHAESUNG DS CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·10 claims
- 1465US11674890B2Saw based optical sensor device and package including the sameHAESUNG DS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·13 claims
- 1565US2026033365A1Semiconductor package substrateHAESUNG DS CO LTD·Filed 2025·Application pending·0 cites
- 1662US2020135357A1Electric wire structure and method of manufacturing thereofHAESUNG DS CO LTD·Filed 2019·Application pending·0 cites
- 1761US11876012B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·21 claims
- 1861US2023106085A1Wireless charge coilHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 1961US2025022722A1Method for manufacturing substrateHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 2060US12041731B2Multilayer circuit board manufacturing apparatusHAESUNG DS CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·14 claims
- 2160US11112352B2Saw based optical sensor device and package including the sameHAESUNG DS CO LTD·Filed 2018·Granted Sep 7, 2021·0 cites·9 claims
- 2260US2025071909A1Method of manufacturing circuit boardHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 2359US12581601B2Reel-to-reel circuit board manufacturing apparatusHAESUNG DS CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·10 claims
- 2459US10840170B2Semiconductor package substrate and method for manufacturing sameHAESUNG DS CO LTD·Filed 2020·Granted Nov 17, 2020·0 cites·7 claims
- 2559US2026076217A1Semiconductor package substrate including graphene layer, method of manufacturing the semiconductor package substrate, and semiconductor package including the semiconductor package substrateHAESUNG DS CO LTD·Filed 2025·Application pending·0 cites
- 2658US2025006508A1Method of manufacturing lead frameHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 2758US2025140661A1Lead frame, semiconductor package including the same, and method of manufacturing the lead frameHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 2857US2026076203A1Semiconductor package substrateHAESUNG DS CO LTD·Filed 2025·Application pending·0 cites
- 2956US10714231B2Graphene wire, cable employing the same, and method of manufacturing the sameHAESUNG DS CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·10 claims
- 3055US12341086B2Lead frameHAESUNG DS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·4 claims
- 3155US2023104216A1Wireless charge coilHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 3253US12308899B2Composite coil pattern for wireless charging and magnetic secure transmissionHAESUNG DS CO LTD·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 3352US2023094795A1Reel-to-reel surface press apparatusHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 3452US2018190406A1Electric wire structure and method of manufacturing thereofHAESUNG DS CO LTD·Filed 2016·Application pending·0 cites
- 3551US11854830B2Method of manufacturing circuit boardHAESUNG DS CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·19 claims
- 3651US10643932B2Semiconductor package substrate and method for manufacturing sameHAESUNG DS CO LTD·Filed 2016·Granted May 5, 2020·0 cites·11 claims
- 3750US2023083630A1Working table for reel-to-reel processHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 3850US2023317574A1Semiconductor package substrate, semiconductor package including the same, and method of manufacturing the semiconductor package substrateHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 3949US10882748B2Graphene synthesis apparatus and graphene synthesis method using the sameHAESUNG DS CO LTD·Filed 2016·Granted Jan 5, 2021·0 cites·16 claims
- 4048US2024431035A1Printed circuit board for cob ic card and method of treating surface of the printed circuit board for the cob ic cardHAESUNG DS CO LTD·Filed 2024·Application pending·0 cites
- 4148US2022274223A1Apparatus for grinding surface of substrateHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 4247US2022285251A1Semiconductor package substrate and method of manufacturing the same, and semiconductor package and method of manufacturing the sameHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 4347US2023080101A1Semiconductor package substrate, method of manufacturing the same, and semiconductor packageHAESUNG DS CO LTD·Filed 2022·Application pending·0 cites
- 4446US11227775B2Method of fabricating carrier for wafer level package by using lead frameHAESUNG DS CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 4546US9257310B2Method of manufacturing circuit board and chip package and circuit board manufactured by using the methodHAESUNG DS CO LTD·Filed 2013·Granted Feb 9, 2016·0 cites·17 claims
- 4645US10811302B2Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the sameHAESUNG DS CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·10 claims
- 4744US12327728B2Method for manufacturing a pre-mold substrateHAESUNG DS CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·13 claims
- 4844US12249571B2Pre-mold substrate and method of manufacturing pre-mold substrateHAESUNG DS CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·16 claims
- 4944US11139220B2Flexible semiconductor package formed by roll-to-roll processHAESUNG DS CO LTD·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 5044US10643933B2Semiconductor package substrate and manufacturing method thereforHAESUNG DS CO LTD·Filed 2016·Granted May 5, 2020·0 cites·9 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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