Assignee
HAN BYUNG JOON
SG·6 granted patents·22 citations·filing 2010–2023
Top patents by PatentIndex Score
6 records- 0185US8674516B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofHAN BYUNG JOON·Filed 2011·Granted Mar 18, 2014·8 cites·18 claims
- 0281US9564413B2Semiconductor device and method of forming semiconductor die with active region responsive to external stimulusHAN BYUNG JOON·Filed 2012·Granted Feb 7, 2017·5 cites·25 claims
- 0378US8125073B2Wafer integrated with permanent carrier and method thereforHAN BYUNG JOON·Filed 2011·Granted Feb 28, 2012·4 cites·33 claims
- 0471US8779565B2Integrated circuit mounting system with paddle interlock and method of manufacture thereofHAN BYUNG JOON·Filed 2010·Granted Jul 15, 2014·3 cites·20 claims
- 0569US9559004B2Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energyHAN BYUNG JOON·Filed 2012·Granted Jan 31, 2017·2 cites·14 claims
- 0659US12532792B2Fan-out packaging device using bridge and method of manufacturing fan-out packaging device using bridgeHAN BYUNG JOON·Filed 2023·Granted Jan 20, 2026·0 cites·16 claims
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