Assignee
HANDO TAKUYA
JP·2 granted patents·1 pending application·5 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0168US8143534B2Wiring board having solder bump and method for manufacturing the sameHANDO TAKUYA·Filed 2009·Granted Mar 27, 2012·5 cites·4 claims
- 0246US2010132997A1Multilayer wiring substrate and method for manufacturing the sameHANDO TAKUYA·Filed 2009·Application pending·0 cites
- 0339US9119333B2Multilayer wiring boardHANDO TAKUYA·Filed 2012·Granted Aug 25, 2015·0 cites·3 claims
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