Assignee
HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC
CN·12 granted patents·13 pending applications·8 citations·filing 2019–2024
Top patents by PatentIndex Score
25 records- 0172USD1018612SPolishing machine for metalHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Granted Mar 19, 2024·5 cites·1 claims
- 0263USD1018613SPolishing machine for metalHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Granted Mar 19, 2024·3 cites·1 claims
- 0361US2024367283A1Wafer polishing systemHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0457US2025065472A1Polishing pad conditioning apparatusHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0556US2026034639A1Online monitoring device for cmpHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0654US2025038031A1Wafer alignment device and method and wafer speed calculation methodHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0753US2025069905A1Multi-wafer scrubbing deviceHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0851US2024208000A1Device and method for calibrating working positions of polishing head and transfer stationHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0950US12538742B2Wafer position detection deviceHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2021·Granted Jan 27, 2026·0 cites·8 claims
- 1050US2026027672A1Eddy current end-point detection device and methodHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1149US12194592B2Polishing and loading/unloading component moduleHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2021·Granted Jan 14, 2025·0 cites·4 claims
- 1245US2025178157A1Method and system for online inspection of surface condition of polishing padHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1345US2025018527A1Wafer polishing system and wafer transfer methodHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1445US2025214196A1Wafer polishing system, loading method and using method thereofHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1545US2025054781A1Array-type megasonic cleaning device for cleaning wafersHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1644US12017293B2Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrateHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2023·Granted Jun 25, 2024·0 cites·16 claims
- 1743US11961749B2Wafer detection device and wafer detection method using the sameHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2020·Granted Apr 16, 2024·0 cites·16 claims
- 1840US11908720B2CMP wafer cleaning equipment, wafer transfer robot and wafer flipping methodHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2019·Granted Feb 20, 2024·0 cites·17 claims
- 1939US12482674B2Wafer cleaning and drying deviceHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2020·Granted Nov 25, 2025·0 cites·4 claims
- 2039US12427619B2Wafer conveying device, chemical mechanical planarization apparatus and wafer conveying methodHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2020·Granted Sep 30, 2025·0 cites·6 claims
- 2138US2023245915A1Wafer transfer device, wafer transfer method and cleaning module of chemical mechanical planarization machineHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 2237US11794304B2Wafer polishing deviceHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Granted Oct 24, 2023·0 cites·8 claims
- 2335USD1112383SCombined polishing and grinding deviceHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2024·Granted Feb 10, 2026·0 cites·1 claims
- 2434US2024404868A1Standing wafer holderHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2527US12251785B2Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unitHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC·Filed 2019·Granted Mar 18, 2025·0 cites·7 claims
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