Assignee
HAYASHI HIROMASA
JP·3 granted patents·5 citations·filing 2009–2014
Top patents by PatentIndex Score
3 records- 0162US8415027B2Laser welding structureHAYASHI HIROMASA·Filed 2009·Granted Apr 9, 2013·4 cites·5 claims
- 0256US8637777B2Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrateHAYASHI HIROMASA·Filed 2009·Granted Jan 28, 2014·1 cites·12 claims
- 0346US9112018B2Insulating substrate, method of manufacturing the same, and semiconductor deviceHAYASHI HIROMASA·Filed 2014·Granted Aug 18, 2015·0 cites·14 claims
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