Assignee
HD MICROSYSTEMS LTD
JP·3 granted patents·6 pending applications·0 citations·filing 2018–2025
Top patents by PatentIndex Score
9 records- 0182US2025362601A1Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic ComponentHD MICROSYSTEMS LTD·Filed 2025·Application pending·0 cites
- 0260US12386257B2Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2020·Granted Aug 12, 2025·0 cites·15 claims
- 0348US2025233103A1Method of manufacturing semiconductor device, hybrid bonding insulation film forming material and semiconductor deviceHD MICROSYSTEMS LTD·Filed 2023·Application pending·0 cites
- 0448US2025201760A1Hybrid bonding insulation membrane forming material, method of producing semiconductor device and semiconductor deviceHD MICROSYSTEMS LTD·Filed 2023·Application pending·0 cites
- 0545US11807721B2Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic componentHD MICROSYSTEMS LTD·Filed 2018·Granted Nov 7, 2023·0 cites·8 claims
- 0644US2023359122A1Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protection film, and electronic componentHD MICROSYSTEMS LTD·Filed 2021·Application pending·0 cites
- 0739US2024092973A1Polyimide precursor, resin composition, photosensitive resin composition, method for manufacturing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface-protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2019·Application pending·0 cites
- 0836US12386256B2Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2019·Granted Aug 12, 2025·0 cites·9 claims
- 0930US2022291584A1Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic ComponentHD MICROSYSTEMS LTD·Filed 2019·Application pending·0 cites
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