Assignee
HE BEI SINOPACK ELECTRONIC TECH CO LTD
CN·3 granted patents·0 citations·filing 2016–2018
Top patents by PatentIndex Score
3 records- 0141US11309439B2Package structure for semiconductor device, and semiconductor deviceHE BEI SINOPACK ELECTRONIC TECH CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·10 claims
- 0240US9999125B2Method for fabricating ceramic insulator for electronic packagingHE BEI SINOPACK ELECTRONIC TECH CO LTD·Filed 2017·Granted Jun 12, 2018·0 cites·5 claims
- 0340US9713252B2Ceramic insulator for electronic packaging and method for fabricating the sameHE BEI SINOPACK ELECTRONIC TECH CO LTD·Filed 2016·Granted Jul 18, 2017·0 cites·5 claims
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