Assignee
HEBEI LIXIN TECH CO LTD
CN·0 granted patents·3 pending applications·0 citations·filing 2016–2018
Top patents by PatentIndex Score
3 records- 0153US2020114474A1Solder paste containing lead free solder composition with high ductility and soldering fluxHEBEI LIXIN TECH CO LTD·Filed 2018·Application pending·0 cites
- 0225US2020122278A1Lead free solder composition with high ductilityHEBEI LIXIN TECH CO LTD·Filed 2018·Application pending·0 cites
- 0317US2017266764A1Lead free solder composition with high ductilityHEBEI LIXIN TECH CO LTD·Filed 2016·Application pending·0 cites
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