Assignee
HEERDEN DAVID VAN
US·1 granted patent·1 pending application·5 citations·filing 2008–2008
Top patents by PatentIndex Score
2 records- 0161US8882301B2Method for low temperature bonding of electronic componentsHEERDEN DAVID VAN·Filed 2008·Granted Nov 11, 2014·5 cites·1 claims
- 0249US2009065554A1Methods and device for controlling pressure in reactive multilayer joining and resulting productHEERDEN DAVID VAN·Filed 2008·Application pending·0 cites
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