Assignee
HEPPNER JOSHUA D
US·2 granted patents·1 pending application·10 citations·filing 2013–2015
Top patents by PatentIndex Score
3 records- 0183US9178328B2Shielded sockets for microprocessors and fabrication thereof by overmolding and platingHEPPNER JOSHUA D·Filed 2013·Granted Nov 3, 2015·5 cites·14 claims
- 0280US9491881B2Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrateHEPPNER JOSHUA D·Filed 2014·Granted Nov 8, 2016·5 cites·18 claims
- 0345US2016028203A1Shielded sockets for microprocessors and fabrication thereof by overmolding and platingHEPPNER JOSHUA D·Filed 2015·Application pending·0 cites
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