Assignee
HERAEUS ELECTRONICS GMBH & CO KG
DE·0 granted patents·20 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
20 records- 0174US2025210573A1Metal sintering preparation and the use thereof for the connecting of componentsHERAEUS ELECTRONICS GMBH & CO KG·Filed 2025·Application pending·0 cites
- 0261US2025025969A1Flux and solder paste comprising said fluxHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 0361US2025025970A1Flux and solder paste comprising said fluxHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 0461US2025025968A1Flux and solder paste comprising said fluxHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 0559US2025320157A1Hydraulically curable inorganic cement compositionHERAEUS ELECTRONICS GMBH & CO KG·Filed 2023·Application pending·0 cites
- 0654US2025223226A1Hydraulically curable inorganic cement compositionHERAEUS ELECTRONICS GMBH & CO KG·Filed 2023·Application pending·0 cites
- 0751US2026060125A1Substrate arrangement, method for producing an electronic assembly, and electronic assemblyHERAEUS ELECTRONICS GMBH & CO KG·Filed 2025·Application pending·0 cites
- 0851US2025070043A1Method for printing an electrically conductive layer on a surface of 3d electronic assembly and associated 3d electronic assemblyHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 0949US2025178978A1Metal-ceramic compositeHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 1048US2024327685A1Composition usable as temporary fixativeHERAEUS ELECTRONICS GMBH & CO KG·Filed 2022·Application pending·0 cites
- 1148US2026022076A1Metal-ceramic substrate with contact areaHERAEUS ELECTRONICS GMBH & CO KG·Filed 2023·Application pending·0 cites
- 1246US2025178980A1Method for structuring a metal-ceramic compositeHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 1343US2025034050A1Metal-ceramic substrate, method for the production thereof, and moduleHERAEUS ELECTRONICS GMBH & CO KG·Filed 2022·Application pending·0 cites
- 1442US2025178979A1Metal-ceramic compositeHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 1542US2024357742A1Printed product, preparation method therefor, and use thereofHERAEUS ELECTRONICS GMBH & CO KG·Filed 2022·Application pending·0 cites
- 1642US2025183116A1Metal-ceramic compositeHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites
- 1741US2026033336A1Metal-ceramic substrate with contact areaHERAEUS ELECTRONICS GMBH & CO KG·Filed 2023·Application pending·0 cites
- 1840US2025375813A1Method for connecting electronic componentsHERAEUS ELECTRONICS GMBH & CO KG·Filed 2025·Application pending·0 cites
- 1936US2025219008A1Electronic modules having electrical connection elements in the form of wedge-wedge-bonded structures not consisting of solid metal materialHERAEUS ELECTRONICS GMBH & CO KG·Filed 2022·Application pending·0 cites
- 2025US2025240884A1Metal-ceramic substrate with contact areaHERAEUS ELECTRONICS GMBH & CO KG·Filed 2025·Application pending·0 cites
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