Assignee
HERAEUS MATERIALS SINGAPORE PTE LTD
SG·8 granted patents·4 pending applications·4 citations·filing 2014–2025
Top patents by PatentIndex Score
12 records- 0166US10960498B2Coated wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2016·Granted Mar 30, 2021·2 cites·16 claims
- 0264US11884991B2Method for increasing the straightness of a thin wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2021·Granted Jan 30, 2024·0 cites·8 claims
- 0361US10399186B2Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metalHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2015·Granted Sep 3, 2019·2 cites·35 claims
- 0456US12084784B2Coated wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2021·Granted Sep 10, 2024·0 cites·19 claims
- 0551US12305306B2Coated round wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2022·Granted May 20, 2025·0 cites·15 claims
- 0640US12404598B2Coated wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2021·Granted Sep 2, 2025·0 cites·17 claims
- 0739US2024006191A1Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packagesHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2020·Application pending·0 cites
- 0838US2016078980A1Copper bond wire and method of making the sameHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2014·Application pending·0 cites
- 0937US2025239566A1Pressureless sintering method for the connection of electronic componentsHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2025·Application pending·0 cites
- 1034US2025015037A1Ball-bond arrangementHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2021·Application pending·0 cites
- 1130US11791309B2Process for electrically connecting contact surfaces of electronic componentsHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2018·Granted Oct 17, 2023·0 cites·19 claims
- 1227US11236430B2Coated wireHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2017·Granted Feb 1, 2022·0 cites·14 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →