Individual holder
HERBSOMMER JUAN A
US·8 granted patents·3 pending applications·86 citations·filing 2010–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
11 records- 0197US9405064B2Microstrip line of different widths, ground planes of different distancesHERBSOMMER JUAN A·Filed 2012·Granted Aug 2, 2016·32 cites·12 claims
- 0295US8304903B2Wirebond-less semiconductor packageHERBSOMMER JUAN A·Filed 2010·Granted Nov 6, 2012·21 cites·7 claims
- 0391US8431979B2Power converter having integrated capacitorHERBSOMMER JUAN A·Filed 2011·Granted Apr 30, 2013·14 cites·18 claims
- 0487US8546925B2Synchronous buck converter having coplanar array of contact bumps of equal volumeHERBSOMMER JUAN A·Filed 2011·Granted Oct 1, 2013·10 cites·15 claims
- 0580US9508633B2High performance power transistor having ultra-thin packageHERBSOMMER JUAN A·Filed 2011·Granted Nov 29, 2016·5 cites·10 claims
- 0677US8760872B2DC-DC converter vertically integrated with load inductor structured as heat sinkHERBSOMMER JUAN A·Filed 2011·Granted Jun 24, 2014·3 cites·3 claims
- 0763US9165865B2Ultra-thin power transistor and synchronous buck converter having customized footprintHERBSOMMER JUAN A·Filed 2011·Granted Oct 20, 2015·1 cites·10 claims
- 0851US8389336B2Semiconductor device package and method of assembly thereofHERBSOMMER JUAN A·Filed 2011·Granted Mar 5, 2013·0 cites·5 claims
- 0941US2013265734A1Interchip communication using embedded dielectric and metal waveguidesHERBSOMMER JUAN A·Filed 2012·Application pending·0 cites
- 1041US2013265733A1Interchip communication using an embedded dielectric waveguideHERBSOMMER JUAN A·Filed 2012·Application pending·0 cites
- 1139US2012200281A1Three-Dimensional Power Supply Module Having Reduced Switch Node RingingHERBSOMMER JUAN A·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HERBSOMMER JUAN A files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →