Assignee
HESSE GMBH
DE·11 granted patents·9 pending applications·7 citations·filing 2013–2025
Top patents by PatentIndex Score
20 records- 0192US12528135B2Wire guide module, and ultrasonic wire bonder therewithHESSE GMBH·Filed 2022·Granted Jan 20, 2026·2 cites·15 claims
- 0289US12226849B2Ultrasonic tool and ultrasonic connection device thereforHESSE GMBH·Filed 2022·Granted Feb 18, 2025·1 cites·26 claims
- 0389US12097570B2Ultrasonic tool and ultrasonic connection device hereinHESSE GMBH·Filed 2022·Granted Sep 24, 2024·1 cites·23 claims
- 0488US2026061524A1Hold-down tool and laser welding system equipped therewithHESSE GMBH·Filed 2025·Application pending·0 cites
- 0588US2026061529A1Hold-down toolHESSE GMBH·Filed 2025·Application pending·0 cites
- 0683US12206134B2Method for electrically contacting a battery blockHESSE GMBH·Filed 2021·Granted Jan 21, 2025·1 cites·15 claims
- 0783US12202065B2Device for heating and determining an actual temperature of a bonding tool of an ultrasonic bonding deviceHESSE GMBH·Filed 2022·Granted Jan 21, 2025·1 cites·12 claims
- 0860US10960488B2Operating method for an ultrasonic wire bonder with active and passive vibration dampingHESSE GMBH·Filed 2016·Granted Mar 30, 2021·1 cites·8 claims
- 0959US2022194014A1Method for producing an electrically conductive connectionHESSE GMBH·Filed 2022·Application pending·0 cites
- 1058US2025010394A1Ultrasonic bonding device and wire guiding module thereforHESSE GMBH·Filed 2024·Application pending·0 cites
- 1151US12390880B2Method for operating an ultrasonic connecting deviceHESSE GMBH·Filed 2023·Granted Aug 19, 2025·0 cites·15 claims
- 1249US2022193811A1Apparatus and method for detecting the temperature of a bonding tool during laser-assisted ultrasonic bondingHESSE GMBH·Filed 2022·Application pending·0 cites
- 1349US2022193815A1Bonding arrangement and bonding toolHESSE GMBH·Filed 2022·Application pending·0 cites
- 1445US2021178515A1Bonding arrangement and bonding toolHESSE GMBH·Filed 2021·Application pending·0 cites
- 1542US2020282488A1Bonding tool and method for producing a bonding toolHESSE GMBH·Filed 2020·Application pending·0 cites
- 1640US11103946B2Method for bonding large modules, and bonding arrangementHESSE GMBH·Filed 2019·Granted Aug 31, 2021·0 cites·14 claims
- 1740US2015336206A1Tool for producing a friction-welded connection between a wire and a substrate, having a pocket-shaped recessHESSE GMBH·Filed 2013·Application pending·0 cites
- 1832US11007601B2Device for establishing a bonding connection and transducer thereforHESSE GMBH·Filed 2015·Granted May 18, 2021·0 cites·15 claims
- 1930US11017554B2Method for securing a bonding product in a working region of a bonderHESSE GMBH·Filed 2019·Granted May 25, 2021·0 cites·16 claims
- 2030US10634572B2Automatic bonding force calibrationHESSE GMBH·Filed 2016·Granted Apr 28, 2020·0 cites·14 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →