Assignee
HIGGINS III LEO M
US·12 granted patents·1 pending application·81 citations·filing 2011–2014
Top patents by PatentIndex Score
13 records- 0197US9508622B2Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosionHIGGINS III LEO M·Filed 2011·Granted Nov 29, 2016·40 cites·20 claims
- 0291US9287200B2Packaged semiconductor deviceHIGGINS III LEO M·Filed 2013·Granted Mar 15, 2016·13 cites·16 claims
- 0391US8921994B2Thermally enhanced package with lid heat spreaderHIGGINS III LEO M·Filed 2012·Granted Dec 30, 2014·11 cites·17 claims
- 0487US9269648B2Thermally enhanced package with lid heat spreaderHIGGINS III LEO M·Filed 2014·Granted Feb 23, 2016·7 cites·20 claims
- 0572US9059144B2Method for forming die assembly with heat spreaderHIGGINS III LEO M·Filed 2012·Granted Jun 16, 2015·3 cites·20 claims
- 0670US8907485B2Copper ball bond features and structureHIGGINS III LEO M·Filed 2012·Granted Dec 9, 2014·2 cites·20 claims
- 0769US8946833B2Packaging for semiconductor sensor devices and methodsHIGGINS III LEO M·Filed 2012·Granted Feb 3, 2015·2 cites·16 claims
- 0868US9111878B2Method for forming a semiconductor device assembly having a heat spreaderHIGGINS III LEO M·Filed 2013·Granted Aug 18, 2015·2 cites·19 claims
- 0964US9685351B2Wire bond mold lock method and structureHIGGINS III LEO M·Filed 2014·Granted Jun 20, 2017·1 cites·9 claims
- 1055US9224651B2Method for plating a semiconductor package leadHIGGINS III LEO M·Filed 2014·Granted Dec 29, 2015·0 cites·15 claims
- 1152US8716066B2Method for plating a semiconductor package leadHIGGINS III LEO M·Filed 2012·Granted May 6, 2014·0 cites·9 claims
- 1247US9111952B2Semiconductor deviceHIGGINS III LEO M·Filed 2013·Granted Aug 18, 2015·0 cites·20 claims
- 1340US2013037931A1Semiconductor package with a heat spreader and method of makingHIGGINS III LEO M·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →