Assignee

HIGHLIGHT OPTOELECTRONICS INC

TW·1 granted patent·0 citations·filing 1997–1997

Technology mixH10H1 H10W1

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0112US5885893AImpact-free wire bonding of microelectronic devicesHIGHLIGHT OPTOELECTRONICS INC·Filed 1997·Granted Mar 23, 1999·0 cites·14 claims

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