Assignee
HIMORI TSUYOSHI
JP·3 granted patents·1 pending application·5 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0171US8604350B2Multilayer wiring substrate and manufacturing method of multilayer wiring substrateHIMORI TSUYOSHI·Filed 2011·Granted Dec 10, 2013·3 cites·15 claims
- 0263US8393078B2Method of manufacturing circuit boardHIMORI TSUYOSHI·Filed 2012·Granted Mar 12, 2013·1 cites·4 claims
- 0362US8561294B2Method of manufacturing circuit boardHIMORI TSUYOSHI·Filed 2012·Granted Oct 22, 2013·1 cites·18 claims
- 0451US2013153138A1Method of manufacturing reuse paste, reuse paste and method of manufacturing circuit board using reuse pasteHIMORI TSUYOSHI·Filed 2012·Application pending·0 cites
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