Assignee
HIRANO KEISUKE
JP·5 granted patents·3 pending applications·20 citations·filing 2008–2012
Top patents by PatentIndex Score
8 records- 0188US8222352B2Silicone resin compositionHIRANO KEISUKE·Filed 2009·Granted Jul 17, 2012·9 cites·15 claims
- 0282US8173743B2Silicone resin compositionHIRANO KEISUKE·Filed 2008·Granted May 8, 2012·4 cites·6 claims
- 0372US8329290B2Silicone resin compositionHIRANO KEISUKE·Filed 2009·Granted Dec 11, 2012·6 cites·22 claims
- 0469US8673444B2Acrylic pressure-sensitive adhesive resin composition, and pressure-sensitive adhesive sheet or pressure-sensitive adhesive tape using the sameHIRANO KEISUKE·Filed 2011·Granted Mar 18, 2014·1 cites·8 claims
- 0551US8298456B2Silicone resin compositionHIRANO KEISUKE·Filed 2011·Granted Oct 30, 2012·0 cites·10 claims
- 0643US2012309885A1Silicone resin composition and thermal conductive sheetHIRANO KEISUKE·Filed 2012·Application pending·0 cites
- 0740US2012286194A1Thermal conductive sheet, insulating sheet, and heat dissipating memberHIRANO KEISUKE·Filed 2012·Application pending·0 cites
- 0840US2012285674A1Thermal conductive sheet, insulating sheet, and heat dissipating memberHIRANO KEISUKE·Filed 2012·Application pending·0 cites
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