Assignee
HIRANO KOICHI
JP·6 granted patents·1 pending application·10 citations·filing 2007–2011
Top patents by PatentIndex Score
7 records- 0186US8435842B2Method for manufacturing flexible semiconductor deviceHIRANO KOICHI·Filed 2009·Granted May 7, 2013·9 cites·12 claims
- 0269US8593720B2Electronic paper and method for producing sameHIRANO KOICHI·Filed 2011·Granted Nov 26, 2013·1 cites·20 claims
- 0356US8324623B2Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chipHIRANO KOICHI·Filed 2011·Granted Dec 4, 2012·0 cites·9 claims
- 0452US2011133137A1Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the sameHIRANO KOICHI·Filed 2011·Application pending·0 cites
- 0548US8691683B2Flip-chip mounting method and bump formation methodHIRANO KOICHI·Filed 2011·Granted Apr 8, 2014·0 cites·8 claims
- 0648US8063486B2Circuit board, method for manufacturing the same, and semiconductor deviceHIRANO KOICHI·Filed 2007·Granted Nov 22, 2011·0 cites·14 claims
- 0738US8871567B2Field-effect transistor and method for manufacturing the sameHIRANO KOICHI·Filed 2011·Granted Oct 28, 2014·0 cites·21 claims
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